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SoC PolarFire: Add footprints for 484 & 1152 BGA
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On both parts a Solder mask clearance of 0.015mm is defined per
the packaging guide.

Both were generated with the Ball Grid Array Footprint Wizard

These footprints are defined here:
https://www.microsemi.com/document-portal/doc_download/1244577-ug0902-polarfire-soc-fpga-packaging-and-pin-descriptions-user-guide
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@pthomas
pthomas committed Sep 22, 2020
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