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hrppd.default.h
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hrppd.default.h
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#ifndef _HRPPD_
#define _HRPPD_
#include <Materials.h>
// -- Overall HRPPD geometry ------------------------------------------------------------------
//
// A formfactor presently assumed for the final production;
#define _HRPPD_TILE_SIZE_ (120.0*mm)
// Walls ~3mm thick are assumed;
#define _HRPPD_OPEN_AREA_SIZE_ (114.0*mm)
// Area covered by the photocathode in the geometry description; should be a good
// enough description of a fully efficient pixellated anode surface of the real sensors;
// As of 2024/01/28: 108mm -> 104mm, since it is not clear whether Incom can deliver 80%
// OAR (Open Area Ratio) in their final sensor design; stick to 75% (first five EIC HRPPDs);
#define _HRPPD_ACTIVE_AREA_SIZE_ (104.0*mm)
// Stick to 5mm fused silica (first five EIC HRPPDs), since it is not clear whether sapphire
// windows will be used for a final production;
#define _HRPPD_WINDOW_THICKNESS_ (5.0*mm)//(3.8mm)
#define _HRPPD_WINDOW_MATERIAL_ m_FusedSilica//m_Sapphire
// Anode base plate and walls; more or less close to reality;
#define _HRPPD_CERAMIC_BODY_THICKNESS_ (9.0*mm)
#define _HRPPD_BASEPLATE_THICKNESS_ (3.0*mm)
// --------------------------------------------------------------------------------------------
// Just to fit everything in;
#define _HRPPD_CONTAINER_VOLUME_HEIGHT_ (32.0*mm)
// -- Dead material ---------------------------------------------------------------------------
//
// Assume 100% coverage pure silver plating 15um thick, 4 layers total (pads on both sides
// and ground around signal layer); FIXME: not true for EIC HRPPDs;
#define _HRPPD_PLATING_LAYER_THICKNESS_ (0.06*mm)
// These are some random numbers to the moment; are only important for time-of-flight;
//+#define _HRPPD_METALLIZATION_REFLECTIVITY_ (0.80)
//+#define _HRPPD_METALLIZATION_ROUGHNESS_ (0.05)
// Assume two plates, 600um thick, ~70% OAR as counted for MCP pore coverage;
#define _EFFECTIVE_MCP_THICKNESS_ (2*0.6*mm*0.3)
// FIXME: change to glass; should not really matter I guess;
#define _EFFECTIVE_MCP_MATERIAL_ m_FusedSilica
#define _READOUT_PCB_THICKNESS_ (2.0*mm)
// Want to decrease material budget around the walls;
#define _READOUT_PCB_SIZE_ (_HRPPD_OPEN_AREA_SIZE_ - 2.0*mm)
// This stuff is pretty vague, merely a placeholder;
#define _ASIC_SIZE_XY_ (16.0)
#define _ASIC_THICKNESS_ (1.0)
#define _ASIC_MATERIAL_ m_Silicon
// XY-size is calculated based on the ASIC size and location;
#define _COLD_PLATE_THICKNESS_ (1.5)
#define _COLD_PLATE_MATERIAL_ m_Aluminum
// Water cooling pipe;
#define _COOLING_PIPE_INNER_DIAMETER_ (_INCH_*0.218)//3/8 )
#define _COOLING_PIPE_WALL_THICKNESS_ (_INCH_*0.016)//1/16)
#define _COOLING_PIPE_MATERIAL_ m_Titanium
// --------------------------------------------------------------------------------------------
// -- QE and Co -------------------------------------------------------------------------------
//
#define _USE_HRPPD_24_DATA_
#ifdef _USE_HRPPD_24_DATA_
#define _QE_DOWNSCALING_FACTOR_ (30.0/34.3)
#else
#define _QE_DOWNSCALING_FACTOR_ (30.0/37.0)
#endif
// Some reasonably optimistic number; assume that it includes an unknown
// HRPPD Collection Efficiency (CE) as well;
#define _SAFETY_FACTOR_ (0.70)
// This number is 1.00 for HRPPDs (no SiPM-like fill factor or such); keep in place
// for historical reasons;
#define _SENSOR_PLANE_GEOMETRIC_EFFICIENCY_ (1.00)
// --------------------------------------------------------------------------------------------
#endif